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| 150 mm x 73 mm x 16 mm (5.9” x 2.9” x 0.6”) | 168 mm x 71 mm x 26 mm (6.6” x 2.8” x 1”) | 194 mm x 92 mm x 15 mm (7.6” x 3.6” x 0.6”) | 191 mm x 79 mm x 34 mm (7.5" x 3.1" x 1.3") | 165 mm x 84 mm x 23 mm (6.5” x 3.3” x 0.9”) |
| 150 mm x 73 mm x 16 mm (5.9” x 2.9” x 0.6”) | | | | |
| | MediaTek Helio P22 MT6762, 8 cores 2.0 GHz | Qualcomm® Snapdragon 626 MSM8953 Pro, 8 cores 2.2 GHz | Texas Instruments OMAP4470 dual-core 1.5 GHz | MediaTek MT6735, ARM Cortex-A53 1.3 GHz 64-bit quad-core |
| | | Android 11 (GMS) Android Enterprise Recommended | | |
| 4.7" capacitive multi-touch 1280x720 pixels Sunlight readable Glove/rain mode Corning® Gorilla® Glass | 4" capacitive multi-touch 480x800 pixels Sunlight readable Glove/rain mode Corning® Gorilla® Glass | 6” capacitive multi-touch (10 points) 1080x1920 pixels Sunlight readable Glove/rain mode Corning® Gorilla® Glass | 4.7" capacitive multi-touch 854x480 pixels Sunlight readable, 600 nits Asahi Dragontrail Glass | 5” capacitive multi-touch 1280×720 pixels Sunlight readable Glove/rain mode Asahi Dragontrail Glass |
| Standard 3.8V 3600 mAh (13.68Wh) Field replaceable Extended 3.8V 7200 mAh (27.36Wh) Field replaceable | 3.8V 4400 mAh (16,72 Wh), field replaceable | 3.8V 8000 mAh (30.4 Wh), field replaceable | 3.7V 5200 mAh (19.2 Wh) Warm-swappable | 3.7V 4800 mAh (17.76 Wh) Field replaceable |
| Front Home, task manager, scan, return Side 2x FN, volume up/down, power | Front Numeric 23 keys, with backlight Side 2x FN, power | Front F1, F2, F3, power Side FN, volume up/down | Front Numeric keyboard, F1, F2, F3, power Side Volume up/down | Side Power, volume up/down, 2x FN |
| Micro USB 2.0, OTG Docking connector Back connector for expandability 3.5mm headphone jack 1x micro SDXC (256GB) 1x micro SIM | Type-C, OTG Docking connector 1x micro SDXC (128GB) 1x Micro-SIM | Type-C, OTG Qualcomm quick charge 3.0 GNSS antenna connector Back connector for expandability 1x micro SDXC (256 GB) 2x nano SIM | USB A host micro USB RS-232 serial 3.5 mm headphone jack Top connector for expandability 1x micro SDHC 1x mini SIM | micro USB, OTG Docking connector 3.5 mm headphone jack 1x micro SDHC 1x micro-SIM supporting 2G/3G/4G/LTE 1x micro-SIM supporting 2G only |
| Cellular (WWAN) Global: 2G (850,900,1800,1900) 3G (1,2,5,8) 4G/LTE (1,3,7,8,20,34,38,39,40,41) NA: 2G (850,900,1800) 3G (1,2,4,5) 4G/LTE (1,2,3,4,5,7,12,17,28A/B,41) Wireless LAN 2.4 GHz + 5 GHz 802.11 a/b/g/n/r/ac PAN BT 5.0 LE NFC 13.56MHz ISO14443A/B, ISO15693 Audio Rear-facing speaker Microphone | Cellular (WWAN) Global: 2G (850,900,1800,1900) 3G (1,5,8) 4G/LTE (1,3,5,7,8,20,34,38,39,40,41) North America: 2G (850, 1800, 1900) 3G (1, 2, 4, 5) 4G/LTE (1,2,3,4,5,7,12,17,28A/B,41) Wireless LAN 2.4GHz/5GHz 802.11a/b/g/n/r/ac PAN BT V5.0 LE NFC 13.56 MHz ISO 14443A/B, ISO 15693 Audio Rear-facing speaker Microphone | Cellular (WWAN) 2G (850,900,1800,1900) 3G (1,2,5,8) 4G/LTE (1,2,3,4,5,7,8,17,20,28,38,39,40,41) Wireless LAN 2.4 GHz + 5 GHz 802.11a/b/g/n/ac PAN BT V4.1 NFC 13.56 MHz ISO 14443A/B, ISO 15693 Audio Headphone support via Type-C Front-facing speaker x3 microphones for noise suppression
| Cellular (WWAN) 2G (850,900,1800,1900) 3G (1,2,5,8) Verizon certified Wireless LAN 2.4 GHz 802.11 b/g/n PAN BT V3.0 Android BT V2.0 Windows Mobile Audio Rear-facing speaker Microphone | Cellular (WWAN) 2G (850,900,1800,1900) 3G (1,2,5,8) 4G (1,2,3,4,8,12,13,17,20,38,39,40) Wireless LAN 2.4 GHz + 5 GHz 802.11 a/b/g/n PAN BT 4.1 NFC 13.56 MHz ISO 14443A/B, ISO 15693 Audio Rear-facing speaker Microphone |
| GPS/AGPS/GLONASS/Galileo/BEIDOU | GPS/AGPS/GLONASS/Galileo/BEIDOU | Dedicated u-blox GNSS receiver GPS/GLONASS/Galileo/BeiDou | Dedicated u-blox GNSS receiver GPS/GLONASS/QZSS | |
| 1D Laser (Zebra SE965HP) 2D Imager (Honeywell N6603) | GPS/AGPS/GLONASS/Galileo/BEIDOU | Dedicated u-blox GNSS receiver GPS/GLONASS/Galileo/BeiDou | Dedicated u-blox GNSS receiver GPS/GLONASS/QZSS | |
| Rear 8 megapixel with autofocus and flash | 8 megapixels with autofocus and flash | Rear 13 megapixel with auto-focus and flash Front 5 megapixel | Rear 8 megapixel with autofocus and flash | Rear 13 megapixel with autofocus and flash Front 2 megapixel |
| Accelerometer Vibration Proximity Ambient light | Gyroscope Accelerometer Magnetometer Proximity Ambient light Compass | Gyroscope Compass Accelerometer Pressure Proximity Ambient light | Accelerometers Gyroscope Compass Pressure Proximity Ambient temperature Ambient light | Compass Accelerometer Gyroscope Pressure Proximity Ambient light |
| Operating -20°C to 60°C (-4°F to 140°F) MIL-STD-810G, Method 501.5 Procedure II Storage -40°C to 60°C (-40°F to 140°F) MIL-STD-810G, Method 501.5/502.5 Procedure I Drop / Shock 26 drops from 1.2 m (4 ft) MIL-STD-810G, Method 516.6 Procedure IV Vibration MIL-STD-810G, Method 514.6 Procedures I, II Sand / Dust IP65, IEC 60529 Water IP65, IEC 60529 Humidity 0 ~ 95% (non-condensing) MIL-STD-810G, Method 507.5 Altitude 4572 m (15.000 ft) MIL-STD-810G, Method 500.5 Procedure I | Operating -20°C to 60°C (-4°F to 140°F) MIL-STD-810G, Method 501.5 Procedure II Storage -40°C to 60°C (-40°F to 140°F) MIL-STD-810G, Method 501.5/502.5 Procedure I Drop / Shock 26 drops from 1.22 m (4 ft) MIL-STD-810G, Method 516.6 Procedures IV Vibration MIL-STD-810G, Method 514.6 Procedure I & II Sand / Dust IP65, IEC 60529 Water IP65, IEC 60529 Humidity 0% ~ 95% (non-condensing) MIL-STD-810G, Method 507.5 Altitude 4572 m/15 000 ft. MIL-STD-810G, Method 500.5 Procedures I | Operating -20°C to 55°C (-4°F to 131°F) MIL-STD-810G, Method 501.5/502.5 Procedure II Storage -40°C to 70°C (-40°F to 158°F) MIL-STD-810G, Method 501.5/502.5 Procedure I Drop / Shock 6 drops from 1.5m, concrete surface IEC 68-2-32:1990 Vibration: MIL-STD-810H:2019 Method 514.8/Procedure I Mechanical shock: MIL-STD-810H:2019 Method 516.8/Procedure I Sand / Dust IP67, IEC 60529 Water IP67, IEC 60529 Humidity 0% ~ 95% (non-condensing) MIL-STD-810G, Method 507.5 Procedure II Altitude 4572 m (15 000 ft) MIL-STD-810G, Method 500.5 Procedures I & II EMC/EMI MIL-STD-461F, CE101, CE102, CS101, CS114, CS115, CS116, RE101, RE102, RS101, RS103 | Operating -30°C to 60°C (-22°F to 140°F), MIL-STD-810G, Method 501.5/502.5 Procedures II, III Storage -40°C to 70°C, MIL-STD-810G, Method 501.5/502.5, Procedure I Drop / Shock 1.2 m (4 ft) MIL-STD-810G, Method 516.6 Procedure IV MIL-STD-810G, Method 516.6 Procedure IV Vibration MIL-STD-810G, Method 514.6, Procedures I, II Sand / Dust IP67 Water IP67 Humidity MIL-STD-810G, Method 507.5 Procedure II Altitude 4572 m (15.000 ft) MIL-STD-810G, Method 500.5 Procedure I Solar Exposure Survives prolonged UVB exposure, MIL-STD-810G, Method 505.5, Procedure II Temperature Shock Cycles between -22 F and 140 F (-30 C and +60 C), MIL-STD-810G, Method 503.5, Procedure I-C | Operating -20°C to 55°C (-4°F to 131°F) MIL-STD-810G, Method 501.5 Procedure II Storage -20°C to 60°C (-4°F to 140°F) MIL-STD-810G, Method 501.5/502.5 Procedure I Drop / Shock 26 drops from 1.5 m (5 ft) MIL-STD-810G, Method 516.6 Procedure IV Vibration MIL-STD-810G, Method 514.6 Procedures I, II Sand / Dust IP67, IEC 60529 Water IP67, IEC 60529 Humidity 5% ~ 95% (non-condensing) MIL-STD-810G, Method 507.5 Procedure II Altitude 4572 m (15.000 ft) MIL-STD-810G, Method 500.5 Procedure II |